The equipment for ohmic contacts formation in semi-conductor devices based on А3В5 connections

  • S. B. Aleksandrov CC «Scientific and Technological Equipment», Saint Petersburg, Russia
  • K. M Krupal'nik CC «Scientific and Technological Equipment», Saint Petersburg, Russia
  • N. O. Kornilov CC «Scientific and Technological Equipment», Saint Petersburg, Russia
  • T. A. Kondratyeva CC «Scientific and Technological Equipment», Saint Petersburg, Russia
Keywords: semiconductor devices, ohmic contacts, electron-beam evaporation

Abstract

Technological process features of ohmic contacts formation in semiconductor devices based on А3В5 connections and the general principles of technological modules construction are considered. The results received by means of installations of an electron-beam evaporation of STE EB series and installations of fast thermal annealing of STE RTA series are shown.

Published
2011-04-28
How to Cite
Aleksandrov, S. B., Krupal’nik, K. M., Kornilov, N. O., & Kondratyeva, T. A. (2011). The equipment for ohmic contacts formation in semi-conductor devices based on А3В5 connections. Technology and Design in Electronic Equipment, (1–2), 49-52. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2011.1-2.49
Issue
No. 1–2 (2011): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2011 Aleksandrov S. B., Krupalnik K. M., Kornilov N. O., Kondratyeva T. A.

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.