Investigation of heat transfer processes in collector thermosyphons of high-density switching boards

Abstract

The processes of heat transfer and fluid dynamics of the coolant in the channels of a collector thermosyphon integrated into a heat-loaded switching board have been investigated. The most rational geometry of evaporator channels has been determined. Experimental dependencies of the surface temperature of switching boards on the applied heat flux have been obtained. It is shown that embedding collector thermosyphons with slot channels into switching boards makes it possible to reduce the temperature in the heat input zone by a factor of two.