Installation for thick‑layer anodizing of aluminum

  • V. A. Sokol Belarusian State University of Informatics and Radioelectronics, Minsk, Belarus
  • E. P. Ignashev Belarusian State University of Informatics and Radioelectronics, Minsk, Belarus
Keywords: thick‑layer anodizing, aluminum, dynamic installation, plate cooling, oxide layer

Abstract

To improve the efficiency of plate cooling during the production of bases from anodized aluminum, it is proposed to carry out the process of thick‑layer anodizing under continuous plate movement. Based on this principle, a dynamic anodizing installation was developed, enabling the formation of oxide layers up to 0.4 mm thick on bases ranging from 48×60 mm to 100×100 mm, as well as substrates of free anodic oxide up to 1 mm thick. The resulting layers exhibit high physical and mechanical properties without oxide loosening.

Published
2003-04-30
How to Cite
Sokol, V. A., & Ignashev, E. P. (2003). Installation for thick‑layer anodizing of aluminum. Technology and Design in Electronic Equipment, (2), 40-41. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2003.2.40
Issue
No. 2 (2003): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2003 V. A. Sokol, E. P. Ignashev

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