Evaluation of the technological process of VLSI manufacturing based on the stability of its structural elements

Abstract

The method of test circuits used in VLSI production is proposed to be supplemented with a technique for identifying time‑unstable elements of the physical structure of the product using a degradation process model. The possibility of conducting accelerated tests on structural elements is demonstrated. Experimental results are presented, showing the feasibility of detecting elements with time‑unstable characteristics at the stage of wafer production with VLSI chips.