Fabrication technology of submicron field emission silicon cathodes

  • A. A. Druzhynin Lviv Polytechnic National University, Ukraine
  • V. I. Holota Lviv Polytechnic National University, Ukraine
  • I. T. Kogut Vasyl Stefanyk Precarpathian National University, Ivano-Frankivsk, Ukraine
Keywords: fabrication technology, submicron size, field emission cathode, electrode aperture, electric field

Abstract

Modern fabrication technologies of field emission cathodes are analyzed. A practical method for forming topological elements of submicron dimensions is proposed. A CMOS-based technology using micron-scale photomasks has been developed and modeled for the fabrication of single-tip, multi-tip, and blade-type field emission silicon cathodes of submicron size. The results of electric field modeling for the field emission cathodes are presented.

Published
2007-10-28
How to Cite
Druzhynin, A. A., Holota, V. I., & Kogut, I. T. (2007). Fabrication technology of submicron field emission silicon cathodes. Technology and Design in Electronic Equipment, (5), 50-53. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2007.5.50
Issue
No. 5 (2007): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2007 Druzhynin A. A., Holota V. I., Kogut I. T.

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.