Investigation of reproducibility of electrophysical parameters of RuO2–glass thick-film structures

  • Sh. D. Kurmashev I. I. Mechnikov Odesa National University, Ukraine
  • N. N. Sadova I. I. Mechnikov Odesa National University, Ukraine
  • T. I. Lavrenova I. I. Mechnikov Odesa National University, Ukraine
  • T. N. Bugayeva I. I. Mechnikov Odesa National University, Ukraine
Keywords: integrated circuits, resistive films, component dispersion

Abstract

The dependence of the electrophysical parameters of RuO2–glass thick-film resistive structures on component dispersion and firing temperature has been investigated. It has been shown that the resistance of the layers can be varied by changing the particle size of the initial components. The use of homogeneous powders of the starting materials increases the adhesion strength of the film to the substrate.

Published
2005-08-30
How to Cite
Kurmashev, S. D., Sadova, N. N., Lavrenova, T. I., & Bugayeva, T. N. (2005). Investigation of reproducibility of electrophysical parameters of RuO2–glass thick-film structures. Technology and Design in Electronic Equipment, (4), 62-64. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2005.4.62
Issue
No. 4 (2005): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2005 Kurmashev Sh. D., Sadova N. N., Lavrenova T. I., Bugayeva T. N.

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