Design and technological options for switching boards with a silicon substrate

  • V. G. Spirin SPA «Temp-Avia», Arzamas, Russia
Keywords: silicon substrate, silicon switching board

Abstract

The design and technological options of switching boards with a silicon substrate featuring two and three switching levels are considered, based on well-established industrial technologies. The use of these boards ensures the maximum possible packing density of microassemblies at a relatively low production cost.

Published
2005-02-28
How to Cite
Spirin, V. G. (2005). Design and technological options for switching boards with a silicon substrate. Technology and Design in Electronic Equipment, (1), 48-50. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2005.1.48
Issue
No. 1 (2005): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2005 Spirin V. G.

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