UDC 621.396.6

Obtaining raised density connections by thermosonic microwelding
in 3D integrated microcircuits

Lanin V. L., Petuhov I. B.

Keywords: microwelding, thermosonic, connections, integrated microcircuits.

The authors consider the processes of obtaining raised density microwelded connections in 3D-integrated microcircuits by the thermosonic microwelding. The processes include the use of the raised frequencies of ultrasound, application of the microinstrument with a thinning of the working end and precision devices for ball formation, which provide reproducibility of connections quality.
At a small step of contact pads, the use of a wire of small diameter (not more than 25 µm) is necessary for devices with a multilevel arrangement of leads and chess arrangement of contact pads on the chip, providing the maximum length of the formed crosspieces does not exceed 4—5 mm.

Belarus, Minsk, BSUIR, KBTEM-CO GNPO «Planar».