Optimization of ink-jet technology for PCB interconnects fabrication

  • R. I. Lesyuk Ya. S. Pidstrygach Institute of Problems of Microelectronics and Design of NASU, Lviv, Ukraine
  • Yа. V. Bobitski Lviv Polytechnic National University, Lviv, Ukraine
  • B. K. Kotlyarchuk Lviv Polytechnic National University, Lviv, Ukraine
  • W. Jillek G.–S. Ohm University of Applied Sciences, Nuremberg, Germany
Keywords: jetting technology, nanoparticles, conductive tracks

Abstract

The effects constraining the quality and resolution of ink-jet silver colloid printing of interconnections are considered. Authors suggest the preliminary surface treatment for spreading minimization and the quality improvement by means of substrate heating and implementation of time delay for multilayer printing. Conductive tracks printing with thickness 30–40 µm was carried out.

Published
2010-12-24
How to Cite
Lesyuk, R. I., Bobitski, Y. V., Kotlyarchuk, B. K., & Jillek, W. (2010). Optimization of ink-jet technology for PCB interconnects fabrication. Technology and Design in Electronic Equipment, (4), 49-52. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2010.4.49
Issue
No. 4 (2010): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2010 Lesyuk R. I., Bobitski Y. V., Kotlyarchuk B. K., Jillek W.

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This work is licensed under a Creative Commons Attribution 4.0 International License.