Analysis of the influence of the method of connecting column leads of integrated circuits on their resistance

  • Z. Yu. Hotra Lviv Polytechnic National University, Ukraine
  • D. T. Dyachok Lviv Polytechnic National University, Ukraine
Keywords: integral circuit, моdеl, pin lead, resistance

Abstract

A model of a rigid pillar lead between the contact pads of the IC substrate and the mounted chip is considered. A method for determining the electrical resistance of the lead is proposed, and the resistance of the pillar lead for different connection methods is determined using this method. The results of the work are recommended for use in the design of semiconductor devices and integrated circuits with pillar (ball) leads.

Published
2009-04-30
How to Cite
Hotra, Z. Y., & Dyachok, D. T. (2009). Analysis of the influence of the method of connecting column leads of integrated circuits on their resistance. Technology and Design in Electronic Equipment, (2), 30-33. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2009.2.30
Issue
No. 2 (2009): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2009 Hotra Z. Yu., Dyachok D. T.

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.