Enhancing adhesion strength of nickel contacts in thermoelectric module branches

  • A. A. Asheulov Institute of Thermoelectricity of the NAS and MES of Ukraine, Chernivtsy, Ukraine
  • Yu. G. Dobrovolskiy SPF «Tensor», Chernivtsy, Ukraine
  • I. S. Romanyuk Business Park «Quartz», Chernivtsy, Ukraine
Keywords: adhesion strength, contact, thermoelectric module, annealing, electric field, magnetic field

Abstract

A method is proposed to improve the adhesion strength of nickel contacts in thermoelectric module branches. The approach consists of treating nickel layers during thermal annealing with a constant magnetic field and pulsed electric fields. As a result, the adhesion strength of nickel layers increases by 1.5–2 times, and its variation after 1000 hours of operation in cyclic mode at temperatures of 213–333 K does not exceed 10%. This demonstrates the effectiveness of the method for enhancing the reliability of thermoelectric modules.

Published
2006-02-28
How to Cite
Asheulov, A. A., Dobrovolskiy, Y. G., & Romanyuk, I. S. (2006). Enhancing adhesion strength of nickel contacts in thermoelectric module branches. Technology and Design in Electronic Equipment, (6), 56-57. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2006.6.56
Issue
No. 6 (2006): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2006 Asheulov A. A., Dobrovolskiy Yu. G., Romanyuk I. S.

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