Non-contact thermal inspection of electronic computing equipment

  • S. P. Panfilova Bauman Moscow State Technical University, Russia
  • A. I. Vlasov Bauman Moscow State Technical University, Russia
  • V. N. Gridnev Bauman Moscow State Technical University, Russia
  • A. S. Chervinsky Bauman Moscow State Technical University, Russia
Keywords: thermal imaging inspection, neural networks, image processing

Abstract

The article analyzes the applicability of thermography for diagnosing electronic devices. Typical faults detectable by thermal imaging are presented. The advantages of non-contact thermal inspection over contact methods are described, along with specific features of thermography for electronic equipment. The thermographic apparatus is outlined, and recommendations for its selection in electronic diagnostics are provided. An example of applying the thermographic method to check electronic devices is given. The main functions of the software used in thermography and its importance are also described.

Published
2007-12-30
How to Cite
Panfilova, S. P., Vlasov, A. I., Gridnev, V. N., & Chervinsky, A. S. (2007). Non-contact thermal inspection of electronic computing equipment. Technology and Design in Electronic Equipment, (6), 42-49. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2007.6.42
Issue
No. 6 (2007): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2007 Panfilova S. P., Vlasov A. I., Gridnev V. N., Chervinsky A. S.

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.