Low-temperature modification of copper films under the influence of atomic hydrogen

  • E. L. Zhavzharov Zaporozhye National Technical University, Ukraine
  • V. M. Matyushin Zaporozhye National Technical University, Ukraine
Keywords: atomic hydrogen, copper films, adhesion, cohesion

Abstract

The possibility of low-temperature modification of the properties of thin copper films under the influence of atomic hydrogen is considered. The results of an experimental study of changes in the adhesion and cohesion properties of copper films within the "copper – silicon" heterostructure as a function of the treatment time with atomic hydrogen are presented. A model is proposed that qualitatively explains the experimental results.

Published
2006-02-28
How to Cite
Zhavzharov, E. L., & Matyushin, V. M. (2006). Low-temperature modification of copper films under the influence of atomic hydrogen. Technology and Design in Electronic Equipment, (1), 50-53. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2006.1.50
Issue
No. 1 (2006): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2006 Zhavzharov E. L., Matyushin V. M.

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This work is licensed under a Creative Commons Attribution 4.0 International License.