Promising materials for low-resistance thick-film resistive elements

  • A. N. Smirnov Research Institute «Temp», Odesа, Ukraine
  • N. S. Puchkova Research Institute «Temp», Odesа, Ukraine
  • R. G. Sidorets Research Institute «Temp», Odesа, Ukraine
  • V. D. Lemza Research Institute «Temp», Odesа, Ukraine
Keywords: resistive elements, composite pastes, thick-film technology

Abstract

The development of highly stable low-resistance variable resistors using thick-film technology is discussed. A paste system based on Ag/Ru/Pd with 35–45% glass binder content provides excellent surface properties and technological characteristics of the resistors. The ability to obtain intermediate values of specific resistance expands the possibilities for designing microassemblies and applying thick-film technology in new areas of engineering.

Published
2005-02-28
How to Cite
Smirnov, A. N., Puchkova, N. S., Sidorets, R. G., & Lemza, V. D. (2005). Promising materials for low-resistance thick-film resistive elements. Technology and Design in Electronic Equipment, (1), 58-59. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2005.1.58
Issue
No. 1 (2005): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2005 Smirnov A. N., Puchkova N. S., Sidorets R. G., Lemza V. D.

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