Prospects for the development of thin-film microassemblies

  • V. G. Spirin SPA «Temp-Avia», Arzamas, Russia
Keywords: thin-film microassembly, substrate, silicon resistors, packing density, design standards

Abstract

Based on the analysis of certain structural and technological options, the prospects for increasing the integration of thin-film microassemblies with substrates made of sitall, polycor, sapphire, and silicon are considered. The technology for manufacturing chromium resistors on silicon is described. An assessment of the packing density of printed and silicon boards is provided.

Published
2005-02-28
How to Cite
Spirin, V. G. (2005). Prospects for the development of thin-film microassemblies. Technology and Design in Electronic Equipment, (1), 3-6. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2005.1.03
Issue
No. 1 (2005): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2005 Spirin V. G.

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