Method for designing the topology of thin-film microassembly with film element sizes of 10–50 μm

  • V. G. Spirin SPA «Temp-Avia», Arzamas, Russia
Keywords: design, topology, thin-film microassembly, resistor dimensions

Abstract

The proposed method makes it possible to design thin-film elements with minimum sizes of 10–50 μm. The increase in microassembly integration is achieved by compensating for systematic errors in the structural parameters of thin-film elements, by modifying the algorithm for calculating resistor dimensions, and by applying specific approaches to the placement of components and resistors.

Published
2004-10-30
How to Cite
Spirin, V. G. (2004). Method for designing the topology of thin-film microassembly with film element sizes of 10–50 μm. Technology and Design in Electronic Equipment, (5), 6-10. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2004.5.06
Issue
No. 5 (2004): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2004 Spirin V. G.

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