Method of layout design for microassembly boards

  • V. G. Spirin SPA «Temp-Avia», Arzamas, Russia
Keywords: board layout, microassembly, surface mounting, thermal management of components

Abstract

A method of layout design for microassembly boards is presented, characterized by high packing density and minimal manufacturing cost. The proposed method allows substantiating the choice of board material, taking into account the specific features of microassembly components and ensuring their thermal operating conditions. The dimensions of the thin-film board should be selected so that the developed photomask multiplication scheme occupies at least 75–85% of the substrate area and does not extend beyond its technological fields.

Published
2004-02-29
How to Cite
Spirin, V. G. (2004). Method of layout design for microassembly boards. Technology and Design in Electronic Equipment, (1), 11-13. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2004.1.11
Issue
No. 1 (2004): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2004 V. G. Spirin

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