Use of ceramics based on (Ni, Co, Mn, Cu)3O4 solid solutions for thick-film thermistors

  • O. I. Shpotyuk SPA «Karat», Lviv, Ukraine
  • I. V. Hadzaman НПП «Карат», Львов, Украина
  • R. V. Okhrymovych SPA «Karat», Lviv, Ukraine
  • M. M. Vakiv SPA «Karat», Lviv, Ukraine
  • S. I. Osechkin SPA «Karat», Lviv, Ukraine
  • V. M. Tsmots Drohobych State Pedagogical University named after Ivan Franko, Ukraine
  • I. M. Brunets SPA «Karat», Lviv, Ukraine
Keywords: solid solution ceramics, thick-film thermistors, semiconductor spinel ceramics, Co-enriched composition, thermal time constant, phase composition, electrical properties, structural morphology

Abstract

Using the example of the Co-enriched composition Cu₀.₁Ni₀.₁Mn₁.₂Co₁.₆O₄, the possibility of using semiconductor spinel ceramics of the NiMn₂O₄–CuMn₂O₄–MnCo₂O₄ system for obtaining highly stable thick-film thermistors with a high thermal time constant value is demonstrated. The technological process for obtaining thick films has been developed, and their phase composition, electrical properties, and stability have been studied. The obtained films are characterized by good structural morphology and high density. The effect of layer thickness on the stability of electrical parameters has been investigated.

Published
2002-10-30
How to Cite
Shpotyuk, O. I., Hadzaman, I. V., Okhrymovych, R. V., Vakiv, M. M., Osechkin, S. I., Tsmots, V. M., & Brunets, I. M. (2002). Use of ceramics based on (Ni, Co, Mn, Cu)3O4 solid solutions for thick-film thermistors. Technology and Design in Electronic Equipment, (4–5), 55-57. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2002.4-5.55
Issue
No. 4–5 (2002): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2002 Shpotyuk O. I., Hadzaman I. V., Okhrymovych R. V., Vakiv M. M., Osechkin S. I., Tsmots V. M., Brunets I. M.

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.