CAD/CAE method of solving the hydrodynamic problem while developing powerful electronic devices

V. E. Trofimov; A. L. Pavlov; Y. G. Mamykin

doi:10.15222/TKEA2018.2.33

V. E. Trofimov Odessa National Polytechnic University, Odesа, Ukraine
A. L. Pavlov Odessa National Polytechnic University, Odesа, Ukraine
Y. G. Mamykin Odessa National Polytechnic University, Odesа, Ukraine

DOI: https://doi.org/10.15222/TKEA2018.2.33

Keywords: liquid cooling of electronic devices, CAD/CAE-modeling, CAELinux, SALOME, OpenFOAM, ParaView

Abstract

The article presents examples of the solution of the hydrodynamic problem that arises in the development of powerful electronic devices requiring liquid cooling using the CAD/CAE modeling method. The authors consider poorly documented or undocumented features of such solution based on the use of free software packages — SALOME, OpenFOAM and ParaView for the CAELinux operating system platform.

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