Comparative analysis of methods for the microcircuit assembly on flexible polyimide carriers

  • V. G. Verbitskiy Institute of Microdevices of NAS of Ukraine, Kyiv, Ukraine
  • V. D. Zhora Institute of Microdevices of NAS of Ukraine, Kyiv, Ukraine
  • V. P. Grunyanskaya Institute of Microdevices of NAS of Ukraine, Kyiv, Ukraine
  • N. I. Plis JSC «Angstrom», Moscow, Russia
Keywords: assembly of chips, a flexible polyimide carrier, connection quality

Abstract

The article presents a classification of methods for the microcircuit assembly with the use of flexible polyimide carriers of different types, and their comparative analysis. The most appropriate method for the manufacturing of flexible dual-layer carriers is singled out.

Published
2013-10-14
How to Cite
Verbitskiy, V. G., Zhora, V. D., Grunyanskaya, V. P., & Plis, N. I. (2013). Comparative analysis of methods for the microcircuit assembly on flexible polyimide carriers. Technology and Design in Electronic Equipment, (5), 37-41. Retrieved from http://www.tkea.com.ua/index.php/journal/article/view/TKEA2013.5.37
Issue
No. 5 (2013): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2013 Verbitskiy V. G., Plis N. I., Zhora V. D., Grunyanskaya V. P.

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.