Devices for quality control of welded joints of leads of packageless chips

  • V. G. Spirin Arzamas Polytechnic Institute (branch) of the NSTU, Russia
Keywords: microassembly, quality control of microcircuit leads welding

Abstract

The author considers the design and operation of two devices for quality control of welded joints between aluminium leads of packageless microcircuits and contact pads of a thin-film circuit.

Published
2013-06-14
How to Cite
Spirin, V. G. (2013). Devices for quality control of welded joints of leads of packageless chips. Technology and Design in Electronic Equipment, (4), 42-43. Retrieved from http://www.tkea.com.ua/index.php/journal/article/view/TKEA2013.4.42
Issue
No. 4 (2013): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2013 Spirin V. G.

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