Models of printed boards for solderless mounting of electronic components by foil perforation method

  • A. A. Yefimenko Odessa National Polytechnic University, Odesа, Ukraine
  • B. P. Paliukh Odessa National Polytechnic University, Odesа, Ukraine
DOI: https://doi.org/10.15222/TKEA2017.4-5.03
Keywords: printed circuit board, foil puncture method, hole mounting method, surface mounting

Abstract

The paper presents models of printed circuit boards for an improved foil perforation method. The density of electrical connections of such printed circuit boards is estimated in comparison with circuit boards obtained using the methods of mounting in holes and surface mounting. The technological differences in the manufacture of printed circuit boards for the foil perforation method and the traditional method are considered.

References

Efimenko A. A., Sobchenko D. L. [Solderless contact connections in electronic printed units]. Tekhnologiya i konstruirovaniev elektronnoi apparature, 2009, no 3, pp. 3-9. (Rus)

Efimenko A. A. [Contact connections in electronicprinted units, made by the method of foil perforation]. Tekhnologiya i konstruirovanie v elektronnoi apparature, 2010, no 4, pp. 15-23. (Rus)

Sabunin A. E. Altium Designer. [New solutions in the design of electronic devices — “Design systems” Series]. Novye resheniya v proektirovanii elektronnykh ustroistv. Moscow, Solon-press, 2009. (Rus)

Medvedev A.M. [Printed circuit boards. Constructions and materials] Pechatnye platy. Konstruktsii i materialy. Moscow, Tekhnosfera, 2005. (Rus)

Published
2017-10-28
How to Cite
Yefimenko, A. A., & Paliukh, B. P. (2017). Models of printed boards for solderless mounting of electronic components by foil perforation method. Technology and Design in Electronic Equipment, (4–5), 3-9. https://doi.org/10.15222/TKEA2017.4-5.03
Issue
No. 4–5 (2017): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2017 Yefimenko A. A., Paliukh B. P.

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.