Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits
Abstract
The authors consider the processes of obtaining raised density microwelded connections in 3D-integrated microcircuits by the thermosonic microwelding. The processes include the use of the raised frequencies of ultrasound, application of the microinstrument with a thinning of the working end and precision devices for ball formation, which provide reproducibility of connections quality.
At a small step of contact pads, the use of a wire of small diameter (not more than 25 µm) is necessary for devices with a multilevel arrangement of leads and chess arrangement of contact pads on the chip, providing the maximum length of the formed crosspieces does not exceed 4–5 mm.
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Copyright (c) 2014 Lanin V. L., Petuhov I. B.
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