Lastovetskii, O., O. Yemets, S. Chuprykov, and O. Bondarenko. “Hardware Component of the System for Monitoring the Motion Parameters of the Mold Oscillation Mechanism”. Technology and Design in Electronic Equipment, no. 3–4, Dec. 2025, pp. 56-65, doi:10.15222/TKEA2025.3-4.56.