The technology of microcircuit assembly on flexible polyimide substrate

  • N. I. Plis JSC «Angstrom», Moscow, Russia
  • V. G. Verbitsky SE "RI of Microdevices", STS "Institute for Single crystals" NASU, Kyiv, Ukraine
  • V. D. Zhora SE "RI of Microdevices", STS "Institute for Single crystals" NASU, Kyiv, Ukraine
  • V. N. Volnistov SE "RI of Microdevices", STS "Institute for Single crystals" NASU, Kyiv, Ukraine
  • V. P. Grunyanskaya SE "RI of Microdevices", STS "Institute for Single crystals" NASU, Kyiv, Ukraine
  • N. N. Sergeyeva SE "RI of Microdevices", STS "Institute for Single crystals" NASU, Kyiv, Ukraine
Keywords: microcircuit assembly, flexible polyimide carrier, ultrasonic welding, weld quality

Abstract

The research is devoted to technology of microcircuit assembly on flexible polyimide substrate. It is proved that such microcircuits provide high reliability and have advantage over other IC models when applied in hermetic micro-assemblies in microelectronic devices that operate under high accelerations, shocks and strong radiation.

Published
2010-12-26
How to Cite
Plis, N. I., Verbitsky, V. G., Zhora, V. D., Volnistov, V. N., Grunyanskaya, V. P., & Sergeyeva, N. N. (2010). The technology of microcircuit assembly on flexible polyimide substrate. Technology and Design in Electronic Equipment, (5–6), 43-45. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2010.5-6.43
Issue
No. 5–6 (2010): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2010 Plis N. I., Verbitsky V. G., Zhora V. D., Volnistov V. N., Grunyanskaya V. P., Sergeyeva N. N.

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.