Effective cooling of powerful super high-frequency microelectronic unit

Abstract

A cooling system for a modified super high-frequency microelectronic unit is proposed with the aim of increasing the transistor’s operating power up to 55 W. To reduce the transistor temperature, the following measures are suggested: decreasing the contact thermal resistance in the “transistor–mounting place of the unit” chain, creating an additional heat removal path from the transistor case using a heat pipe, and improving the isothermality of the unit’s baseplate by embedding heat pipes. The results of experimental studies on the thermal efficiency of these proposals are presented.