Heat-pipe coolers for thermally loaded PC components

  • B. M. Rassamakin NTUU «Kiev politechnic university», Ukraine
  • V. A. Rogachev NTUU «Kiev politechnic university», Ukraine
  • S. M. Khayrnasov NTUU «Kiev politechnic university», Ukraine
Keywords: cooler, heat pipe, fins, thermal efficiency, thermal resistance

Abstract

The results of experimental studies of various cooling systems based on heat pipes for thermally loaded components of personal computers are presented. A comparative analysis of their thermal efficiency and thermal resistance has been carried out. A new heat-pipe cooler with improved thermal and weight characteristics, developed at NTUU “KPI”, is proposed.

Published
2006-08-31
How to Cite
Rassamakin, B. M., Rogachev, V. A., & Khayrnasov, S. M. (2006). Heat-pipe coolers for thermally loaded PC components. Technology and Design in Electronic Equipment, (4), 48-50. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2006.4.48
Issue
No. 4 (2006): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2006 B. M. Rassamakin, V. A. Rogachev, S. M. Khayrnasov

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This work is licensed under a Creative Commons Attribution 4.0 International License.