Mounting of microassemblies with silicon substrate

  • V. G. Spirin Arzamas Polytechnic Institute (branch) of the NSTU, Russia
Keywords: mounting of bare dies, silicon microassembly, microassembly base

Abstract

A technology is presented for mounting bare dies with volumetric leads and components in mini-packages onto a silicon board. Several design and technological options for mounting a silicon microassembly onto a metal base are considered.

Published
2005-04-29
How to Cite
Spirin, V. G. (2005). Mounting of microassemblies with silicon substrate. Technology and Design in Electronic Equipment, (2), 46-48. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2005.2.46
Issue
No. 2 (2005): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2005 Spirin V. G.

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.