Thermal regime of a radio-electronic unit with an isothermal substrate and controlled temperature

Abstract

The results are presented of developing a non-hermetic electronic unit with a board designed as a flat heat pipe, connected to a heat removal and temperature regulation system based on gas-filled heat pipes. The feasibility of creating units in which cooling of components is achieved through heat pipes is demonstrated. Connecting isothermal substrates to the thermal control system makes it possible to significantly narrow the range of temperature fluctuations of the components and reduce their operating temperature level.