Technological means for manufacturing microstrip lines for EHF hybrid integrated circuits

Abstract

The paper shows that the main challenges in manufacturing film hybrid integrated circuits for microwave and extremely high frequencies consist in selecting the substrate material, methods for precise conductor formation, and techniques and regimes for depositing high-conductivity metals without an adhesion sublayer. These challenges can be successfully resolved by using polymer substrates, ion etching methods with a Kaufmann-type ion source, and magnetron sputtering of metals.