Experience in improving thick-film technology

  • L. I. Panov Research Institute «Temp», Odesа, Ukraine
  • R. G. Sidoretz Research Institute «Temp», Odesа, Ukraine
Keywords: thick-film technology, hybrid technology, special materials, thick-film microassemblies, printed circuit boards, surface mounting

Abstract

The advantages and merits of thick-film hybrid technology, as well as certain shortcomings of the method that should be taken into account in the development and production of electronic equipment, are presented. The results of the creation, industrial implementation, and application of sets of special materials for manufacturing thick-film microassemblies, printed circuit boards, and surface mounting of electronic components are considered.

Published
2002-02-28
How to Cite
Panov, L. I., & Sidoretz, R. G. (2002). Experience in improving thick-film technology. Technology and Design in Electronic Equipment, (1), 43-46. Retrieved from https://www.tkea.com.ua/index.php/journal/article/view/TKEA2002.1.43
Issue
No. 1 (2002): Tekhnologiya i konstruirovanie v elektronnoi apparature
Section
Articles

Copyright (c) 2002 Panov L. I., Sidoretz R. G.

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This work is licensed under a Creative Commons Attribution 4.0 International License.