Open-loop cooling system for a high-power transistor using phase-change materials

Abstract

Using the cooling of a 2T808A high-power transistor as an example, the possibility of applying an open-loop cooling system with phase-change materials (wax and paraffin) featuring continuous feeding of the melting substance into the heating zone as it melts is demonstrated for cooling and thermal stabilization of radio-electronic equipment heat-dissipating elements. By comparing the experimentally obtained transistor case temperature values under the described cooling method with those for cooling without a heat sink and with natural air convection heat sink, the advantages of the proposed method are shown.